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Substrat de ambalare. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 la 18 straturi,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

Suntem un profesionist de dezvoltare a tehnologiei pachetului de substrat Inte, producem în principal substrat cu pas cu denivelare ultra-mic, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, producem în principal substrat cu pas cu denivelare ultra-mic, ultra-small trace and spacing packaging substrate and PCBs. În domeniul electronicelor moderne, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…