What is Package Substrate?
Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.
Ce este substratul de ambalare a cipului flip?
Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.
Ce este substratul BGA?
BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.
Ce este tehnologia de ambalare FCBGA?
We are a professional FCBGA Packaging, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.
What is FCBGA Package?
We are a professional FCBGA package, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.
Care este definiția substratului pachetului FCBGA?
FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com