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Cross blind/buried via PCB manufacturing. Le substrat de package sera fabriqué avec des matériaux Showa Denko et Ajinomoto à grande vitesse.

3D Ceramic Packages Substrate manufacturing, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.

Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Substrat d'emballage avancé.

Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa Denko and Ajinomoto High speed materials. or other types core materials.

Mini Ceramics PCB manufacturing. Nous pouvons produire le meilleur pas de bosse le plus samlle avec 100um, La meilleure trace la plus petite est 9UM.

Embedded IC PCB manufacturing. Open Depth control slot on the PCBs. Put the IC in the slot of the PCBs. we can use the High frequency and high speed materials.