Archives d'actualités - TECHNOLOGIE ALCANTA(SHENZHEN)CO., LTD

Règles de conception FC-BGA & production process capabilities FC-BGA design rules & Capacités de processus de production, Les substrats FC-BGA sont des forfaits semi-conducteurs avec une règle de conception fine et une forte fiabilité,La conception standard du substrat d'emballage FCBGA est 8 à 16 couches, and the material used is Japanese ABF (Ajinomoto) film, Par exemple: Gx92r, Gxt31r2, GZ41R2H,…

Custom BGA/IC Substrates play a crucial role in modern semiconductor packaging, serving as the bridge between the silicon chip and the printed circuit board (PCB). IC substrates provide electrical connections, support mécanique, and thermal dissipation pathways, ensuring the functionality and reliability of advanced electronic devices. Among various packaging technologies, Ball…

The rapid evolution of semiconductor technology has driven the need for more advanced packaging solutions to meet the increasing demands of high-performance computing, IA, and data-intensive applications. Traditional organic and silicon-based substrates are facing limitations in electrical performance, thermal management, and miniaturization. Par conséquent, Custom Glass Class Package Substrate…

A Custom QFN/QFP Lead Frame is a specialized metal framework designed to provide electrical connections, support mécanique, and thermal dissipation for semiconductor devices using QFN (Quad Flat No-lead) or QFP (Ensemble quadruple) packaging. These lead frames are tailored to meet specific design and performance requirements, ensuring optimal functionality in…

Custom FCBGA Package Substrate Service plays a pivotal role in advancing modern semiconductor packaging solutions. As a tailored service, it focuses on designing and manufacturing specialized substrates for FCBGA (Flip-Chip Ball Grid Array) packaging, a technology widely recognized for its high-performance and miniaturization capabilities. FCBGA packaging relies on flip-chip technology…

Semiconductor packaging plays a crucial role in modern electronics, serving as the bridge between integrated circuits (CI) and external components. It not only protects delicate semiconductor chips but also ensures efficient electrical connections and thermal management. As electronic devices become more compact and powerful, advanced packaging solutions are essential to…