Btラミネート基板の製造
Btラミネート基板の製造. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.
Cavity substrate manufacturing
Cavity substrate manufacturing. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 レイヤーに 30 レイヤー.
Bt laminate substrate manufacturing
Bt laminate substrate manufacturing, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate.
Ultrathin BT PCB manufacturing
Ultrathin BT PCB manufacturing, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.
低 CET PCB 製造
Professional Low CET PCB manufacturing, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing PCB and package substrate.
極薄BT PCB製造
Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, the best smallest trace and spacing are 9um/9um.
電話番号: +86 (0)755-8524-1496
Eメール: info@alcantapcb.com