Semiconductor BGA substrates Manufacturer
Semiconductor BGA substrate Manufacturer, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate
半導体IC基板メーカー
半導体IC基板メーカー. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
Ceramic package substrate Manufacturer
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 に 18 レイヤー
Substrate package Manufacturer
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Substrate Packaging Manufacturer
Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 に 18 レイヤー,
トップ 10 パッケージ基板メーカー
トップ 10 パッケージ基板メーカー, 極小バンプピッチ基板を主に生産しております, ultra-small trace packaging substrate from 2~20L
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