リジッドフレックスパッケージ基板会社
Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.
半導体FC-BGA基板メーカー
半導体FC-BGA基板メーカー. We use advanced Msap and Sap technology, High multilayer interconnection.
Semiconductor BGA substrates Manufacturer
Semiconductor BGA substrate Manufacturer, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate
Ceramic package substrate Manufacturer
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 に 18 レイヤー
Substrate package Manufacturer
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
電話番号: +86 (0)755-8524-1496
Eメール: info@alcantapcb.com