Micro cavity substrates manufacturing
Micro cavity substrates manufacturing. Open a micro Cavity on the PCBs or BGA package substrates. we have made many cavity PCBs from 4 레이어 30 레이어. high quality and fast lead times.
Bt laminate PCB manufacturing
Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.
Cavity substrate manufacturing
Cavity substrate manufacturing. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 레이어 30 레이어.
Bt 라미네이트 기판 제조
Bt 라미네이트 기판 제조, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and spacing packaging substrate.
초박형 BT PCB 제조
초박형 BT PCB 제조, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.
낮은 CET PCB 제조
Professional Low CET PCB manufacturing, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and spacing PCB and package substrate.
전화: +86 (0)755-8524-1496
이메일: info@alcantapcb.com