Rigid-Flex Packaging Substrate Firm
Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.
Semiconductor FC-BGA substrate Manufacturer
Semiconductor FC-BGA substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection.
Semiconductor BGA substrates Manufacturer
Semiconductor BGA substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate
Semiconductor IC substrate Manufacturer
Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
Ceramic package substrate Manufacturer
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 camadas
Substrate package Manufacturer
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
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