Trade News Archives - Page 44 of 94 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD

Rigid-Flex Packaging Substrate Firm
March 14, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.
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Semiconductor FC-BGA substrate Manufacturer
March 13, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Semiconductor FC-BGA substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection.
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Semiconductor BGA substrates Manufacturer
March 12, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Semiconductor BGA substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate
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Semiconductor IC substrate Manufacturer
March 11, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
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Ceramic package substrate Manufacturer
March 8, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers
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Substrate package Manufacturer
March 7, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
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