Trade News Archives - Page 45 of 94 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD

Substrate Packaging Manufacturer
March 6, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,
Read more
Top 10 Packaging Substrate Manufacturer
March 5, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Top 10 Packaging Substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace packaging substrate from 2~20L
Read more
Organic Packaging Chip Substrates Manufacturer
March 4, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 layer to 20 layers.
Read more
Global Packaging Substrate Manufacturer
March 1, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Global Packaging Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
Read more
Top 10 package Substrate Manufacturer
February 29, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 layer to 20 layers.
Read more
Global Semiconductor packaging Manufacturer
February 28, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
Read more