Trade News Archives - Page 50 of 94 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD

Flip Chip CSP (FCCSP) Firm
January 30, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 layer to 20 layers. we also offer the Flip Chip CSP package service.
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What is Ceramic package substrate?
January 29, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 layer to 30 layers.
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What is a semiconductor BGA substrate?
January 26, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
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What is a semiconductor FC BGA substrate?
January 25, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
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What is Rigid-Flex BGA Substrate?
January 24, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
We are a professional Rigid-flex BGA substrate quote, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.
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What is Rigid-Flex Packaging Substrate?
January 23, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
We are a professional Rigid-flex packaging substrate quote supplier, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace.
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