Trade News Archives - Ukurasa 50 ya 94 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 50

Cavity PCB Substrate mtengenezaji. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.

Flip Chip CSP (FCCSP) Thabiti. Tunazalisha kasi ya juu na kiwango cha juu cha vifaa vya ufungaji kutoka 2 Tabaka kwa 20 tabaka. Tunatoa pia huduma ya kifurushi cha Flip Chip CSP.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 Tabaka kwa 30 tabaka.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Rigid-flex BGA substrate quote, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.