What is BGA Substrate?
BGA基板. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.What is FCBGA packaging technology?
We are a professional FCBGA Packaging, 極小バンプピッチ基板を主に生産しております, ultra-small trace and PCBs.FCBGAパッケージとは?
We are a professional FCBGA package, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate.FCBGAパッケージ基板の定義は何ですか?
FCBGA package Substrate.High speed material packaging substrate manufacturing. 先進的なパッケージ基板の製造プロセス.パッケージングの基板が本当に何なのか疑問に思いましたか?
包装基板. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 に 18 レイヤー,What is a Flip Chip Package Substrate?
Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. 先進的なパッケージ基板の製造プロセスと技術.
アルカンタテクノロジー(深セン)株式会社 




