Trade News Archives - ページ 57 の 94 - アルカンタテクノロジー(深セン)株式会社 - ページ 57

We are a professional Substrate package technology development Inte, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate and PCBs. In the field of modern electronics, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…

bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1んん. 0.15んん.0.2んん.0.25んん.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. BT樹脂材料には優れた機械式があります, 熱, および電気的特性.

We are a professional Pathfinding department substrate and packaging technology development, we mainly produce ultra-small trace and PCBs. In the current landscape of rapid technological advancement, the Pathfinding Department stands as a linchpin in the realm of packaging technology. As a vanguard within the engineering domain, the department's commitment to…