Sobre Contato |
Telefone: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com

Trade News Archives - Page 58 of 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO., LTD - Page 58

  • Why choose a specific packaging substrate material?

    Why choose a specific packaging substrate material?

    Packaging substrate materials names and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 camadas. Packaging substrate materials, as core components of modern electronic devices, play a vital role. These materials serve both as support structures for circuits and as critical
  • What is packaging substrate definition?

    What is packaging substrate definition?

    Packaging substrate definition and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 camadas. In the realm of contemporary electronics, packaging substrates emerge as integral components within electronic devices, shouldering the crucial responsibilities of connection, support, and protection for electronic elements.
  • What tools does Substrate Tools include?

    What tools does Substrate Tools include?

    Package substrate tools and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 camadas. Package substrate tools play an integral role in modern electronics manufacturing. In the rapidly developing technology field, Package Substrate Tools are not just simple devices, but also
  • What steps does the packaging substrate process include?

    What steps does the packaging substrate process include?

    We are a professional Package substrate process, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. In today's digital era, electronic devices gradually penetrate people's daily lives, from smartphones to household appliances, all without advanced electronic manufacturing technology. As the core component of electronic
  • Why is the modulus of the packaging substrate important?

    Why is the modulus of the packaging substrate important?

    Package substrate modulus and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 camadas. Packaging substrates, as an integral part of electronic devices, play a key role. In the wave of modern technology, it undertakes multiple tasks such as supporting electronic
  • Why is CTE important for substrate materials?

    Why is CTE important for substrate materials?

    We are a professional Package substrate material cte, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.