Trade News Archives - ページ 62 の 94 - アルカンタテクノロジー(深セン)株式会社 - ページ 62

In the dynamic realm of contemporary electronics, semiconductor packaging substrates assume a pivotal and irreplaceable role. They serve as the very bedrock of electronic equipment, delivering essential support and protection for intricate circuits. The choice and performance of packaging substrate materials wield a profound influence on the efficacy, dependability, そして…

急速に発展している電子分野で, 有機基板パッケージの重要性は無視することはできません. 電子機器のコアコンポーネントとして, パフォーマンスに影響します, 信頼性とコスト. 有機基板パッケージは、当社のデバイスに強固な基盤を提供します, allowing us to rely on a variety of innovative electronic products in…

The FCBGA (フリップチップボールグリッドアレイ) packaging substrate is a key component of this technology and plays an indispensable role. FCBGA packaging substrate provides a highly integrated solution that can achieve more functions, higher performance and lower energy consumption in miniaturized electronic devices. This compact packaging method not only…

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 レイヤーに 18 レイヤー. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 レイヤーに 18 layer

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. のような: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. または 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…