Trade News Archives - ページ 64 の 94 - アルカンタテクノロジー(深セン)株式会社 - ページ 64

ABF Substrates Supplier . Smallest gap ABF Substrates manufacturer from 4 レイヤーに 14 レイヤー. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. we can produce 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…

ABF基板メーカー. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 レイヤーに 14 レイヤー.

Rogers RT/duroid® 5880LZ PCB maker. Dk of 2.00 +/- .04, Low dissipation factor ranging from .0021 に .0027 10GHzで, Low density of 1.4 gm/cm3, 低い Z 軸熱膨張係数 40 ppm/℃.

ロジャース RT/デュロイド® 6002 プリント基板の製造. 誘電率 (DK) の 2.94 +/- .04, の誘電正接 .0012 10GHzで, Dk の低い熱係数 12 ppm/℃, 低い Z 軸熱膨張係数 24 ppm/℃.

Antenna PCB Manufacturing. Antenna Rogers RT/duroid 5880 high frequency PCBs. Low dielectric constant (DK 2.2) . の誘電正接 .0009 10GHzで. and Low moisture absorption. The Antenna PCB was made with High Frequency materials.

ロジャース 5880 Antenna PCB Fabrication, Embedded cavity Rogers 5880 プリント基板, Ro5880 Cavity PCB Manufacturer in China. RT5880 PCB Materials Features: Dk is 2.20 +/- .02. の誘電正接 .0009 at 10GHz.Low moisture absorption. RT/デュロイド 5880 ラミネートは誘電率が低い (DK) 低誘電損失, making them well suited…