Trade News Archives - ページ 64 の 94 - アルカンタテクノロジー(深セン)株式会社 - ページ 64

Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 レイヤーに 18 レイヤー. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…

Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.

FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 レイヤーに 14 レイヤー. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…

ABF Substrates Supplier . Smallest gap ABF Substrates manufacturer from 4 レイヤーに 14 レイヤー. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. we can produce 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…

ABF基板メーカー. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 レイヤーに 14 レイヤー.

Rogers RT/duroid® 5880LZ PCB maker. DKの 2.00 +/- .04, Low dissipation factor ranging from .0021 に .0027 10GHzで, Low density of 1.4 GM / CM3, 低い Z 軸熱膨張係数 40 ppm/℃.