Trade News Archives - 페이지 62 of 94 - 알칸타 기술(선전)주식회사 - 페이지 62

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 레이어 18 레이어. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

FC BGA 패키지란 무엇입니까?? FC BGA 패키지 참조 가이드. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 레이어 18 layer

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. 와 같은: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. or 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. So. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!

Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 레이어 18 레이어. our company asways made the 10…

Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) 및 반적층 공정 (수액). 9um/9um FC BGA 패키징 기판으로 트레이스/간격을 수행합니다. 이러한 획기적인 방법론은 PCB 생산에 혁명을 일으켰습니다., 업계를 새로운 수준의 혁신과 효율성으로 발전시키는 탁월한 기능을 제공합니다..