무역 뉴스 보관소 - 페이지 62 ~의 94 - 알칸타 기술(선전)주식회사 - 페이지 62

In the dynamic realm of contemporary electronics, semiconductor packaging substrates assume a pivotal and irreplaceable role. They serve as the very bedrock of electronic equipment, delivering essential support and protection for intricate circuits. The choice and performance of packaging substrate materials wield a profound influence on the efficacy, dependability, 그리고…

In the rapidly developing electronics field, the importance of organic substrate packaging cannot be ignored. As a core component of electronic equipment, it affects performance, 신뢰성과 비용. Organic substrate packaging provides a solid foundation for our devices, allowing us to rely on a variety of innovative electronic products in…

The FCBGA (플립 칩 볼 그리드 어레이) 패키징 기판은 이 기술의 핵심 구성 요소이며 필수적인 역할을 합니다.. FCBGA 패키징 기판은 더 많은 기능을 달성할 수 있는 고도로 통합된 솔루션을 제공합니다., 소형 전자 장치의 성능 향상 및 에너지 소비 감소. This compact packaging method not only…

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 레이어 18 레이어. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

FC BGA 패키지란 무엇입니까?? FC BGA 패키지 참조 가이드. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 레이어 18 층

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. 와 같은: 10 layer Flip-Chip Package Substrates. 12 층. 14 층. 또는 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…