무역 뉴스 보관소 - 페이지 64 ~의 94 - 알칸타 기술(선전)주식회사 - 페이지 64

Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 레이어 18 레이어. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…

Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, 우수성에 대한 우리의 헌신은 우리의 가장 작은 갭 ABF 기질에서 분명합니다.. SAP 기술 사용, 우리는 ABF 기본 재료의 힘을 활용하여 비교할 수없는 품질을 전달합니다..

FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 레이어 14 레이어. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…

ABF Substrates Supplier . Smallest gap ABF Substrates manufacturer from 4 레이어 14 레이어. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. we can produce 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…

ABF 기판 제조업체. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 레이어 14 레이어.

Rogers RT/duroid® 5880LZ PCB maker. Dk of 2.00 +/- .04, Low dissipation factor ranging from .0021 에게 .0027 10GHz에서, Low density of 1.4 gm/cm3, Low Z-axis coefficient of thermal expansion at 40 ppm/°C.