Trade News Archives - 페이지 64 of 94 - 알칸타 기술(선전)주식회사 - 페이지 64

Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.

FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 레이어 14 레이어. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…

ABF Substrates Supplier . Smallest gap ABF Substrates manufacturer from 4 레이어 14 레이어. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. we can produce 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…

ABF 기판 제조업체. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 레이어 14 레이어.

Rogers RT/duroid® 5880LZ PCB maker. Dk of 2.00 +/- .04, Low dissipation factor ranging from .0021 에게 .0027 at 10GHz, Low density of 1.4 gm/cm3, Low Z-axis coefficient of thermal expansion at 40 ppm/°C.

로저스 RT/duroid® 6002 PCB 제작. Dielectric constant (DK) of 2.94 +/- .04, Dissipation factor of .0012 at 10GHz, Low thermal coefficient of Dk at 12 ppm/°C, Low Z-axis coefficient of thermal expansion at 24 ppm/°C.