Trade News Archives - 페이지 63 of 94 - 알칸타 기술(선전)주식회사 - 페이지 63

FC BGA 패키징 기판 공급업체. 우리는 Msap 및 Sap 기술을 사용하여 9um 간격의 가장 작은 패키징 기판을 생산했습니다.. 선 너비도 9um입니다.. 우리는 FC BGA 패키징 기판을 생산할 수 있습니다. 2 레이어 16 레이어. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L to 16 레이어. The substrates base(핵심) materials are the BT base materials. ABF base materials. High frequency and high speed materials. and others. Our company offer high quality…

Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. 와 같은: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…

Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 레이어 18 레이어. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…

Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.

FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 레이어 14 레이어. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…