Trade News Archives - Ukurasa 63 ya 94 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 63

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. Kwa hivyo. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!

Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 Tabaka kwa 18 tabaka. our company asways made the 10…

Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) na Michakato ya Nusu Nyongeza (SAP). Kufanya ufuatiliaji/nafasi kwa kutumia vifungashio vya 9um/9um FC BGA. Mbinu hizi kuu zimeleta mapinduzi makubwa katika uzalishaji wa PCB., kutoa uwezo usio na kifani ambao unasukuma tasnia kwenye viwango vipya vya uvumbuzi na ufanisi.

FC BGA Packaging Substrate Supplier. We have used the Msap and Sap technology to produce the the smallest Packaging Substrate with 9um gap. and the lines width are 9um too. we can produce the FC BGA Packaging Substrate from 2 Tabaka kwa 16 tabaka. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L to 16 tabaka. The substrates base(msingi) materials are the BT base materials. ABF base materials. High frequency and high speed materials. na wengine. Our company offer high quality…

Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Kama: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…