Kitengo Kidogo Zaidi cha Lami
Mtengenezaji wa Sehemu ndogo ya Lami yenye kiwango cha juu sana. Utengenezaji wa PCB ya Nafasi ya Juu Zaidi. Substrate ilitengenezwa kwa teknolojia ya hali ya juu ya Msap au Sap. Kwa hivyo. tunaweza kuzalisha 9um/9um kuwaeleza / nafasi Substrate au PCBs. wakati wa kuongoza ni haraka. na Ubora thabiti!Advanced Package Substrate
Mtengenezaji wa Substrate ya Kifurushi cha hali ya juu. Tumetumia mchakato wa kiteknolojia wa Msap na Sap kutengeneza substrates za Package na Rogers Materials BT Materials., Nyenzo za ABF, na aina nyingine Nyenzo. mbalimbali ya tabaka kuu ya bidhaa zetu ni kutoka 4 Tabaka kwa 18 tabaka. kampuni yetu mara moja ilifanya 10…Waht ni Mchakato wa MSAP na SAP?
Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) na Michakato ya Nusu Nyongeza (SAP). Kufanya ufuatiliaji/nafasi kwa kutumia vifungashio vya 9um/9um FC BGA. Mbinu hizi kuu zimeleta mapinduzi makubwa katika uzalishaji wa PCB., kutoa uwezo usio na kifani ambao unasukuma tasnia kwenye viwango vipya vya uvumbuzi na ufanisi.Kifungashio Kidogo cha FC BGA
Msambazaji wa Kifungashio cha FC BGA. Tumetumia teknolojia ya Msap na Sap kutengeneza Kifungashio kidogo kabisa chenye pengo la 9um.. na upana wa mistari ni 9um pia. tunaweza kutengeneza Kifungashio cha FC BGA kutoka 2 Tabaka kwa 16 tabaka. the best smallest via holes size…Kifurushi Kidogo cha Kifurushi cha Flip Chip
Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L hadi 16 tabaka. The substrates base(msingi) materials are the BT base materials. ABF base materials. High frequency and high speed materials. na wengine. Our company offer high quality…Flip chip ufungaji wa ufungaji
Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Kama: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…
TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD 




