Ceramic PCB Fabrication

ceramic-pcb-fabrication

Ceramic PCB 제작. Addressing the unique challenges of satellite power supply design, curamik® ceramic substrates excel in demanding applications that require a long lifetime, high reliability and robustness. Si3N4 ceramic substrates, 예를 들어, carry higher currents and provide higher voltage isolation. They operate over a wide temperature range. 게다가, the different metal layers are combined hermetically using the curamik bonding process. We are the Ceramic PCB manufacturer in China.

In space, malfunction or failure as that may jeopardize an entire mission as power electronics cannot be repaired or replaced. Radiation and the absence of atmosphere and gravity make it necessary to use radiation-hardened components that dissipate heat by conduction and radiation only. Special provisions are required to prevent damage and provide reliable, long-term, unattended operation when it comes to designing how satellites are powered.

The high heat conductivity, along with the high heat capacity and thermal spreading of the thick copper cladding, makes curamik substrates indispensable to power electronics, particularly for mission-critical applications like satellite power management.

curamik® Performance

• SI를 기반으로합니다₃N₄ 도자기 및 활성 금속에서 생산 (와 함께) 프로세스
• 긴 수명이있는 응용 분야에서 사용됩니다, 높은 전력 밀도와 견고성이 필요합니다
• 열전도율을 제공합니다 90 W/M K @ 20 ° C
• 사용 가능 6 두께 조합
• CTE의 2.5 PPM/K @ 20 ° C – 300℃

curamik® Power

• 알₂영형₃ provides best price-performance ratio
• Offers sufficient thermal and mechanical properties for the most common applications
• 열전도율을 제공합니다 24 W/M K @ 20 ° C
• 많은 두께 조합으로 제공됩니다
• CTE의 6.8 PPM/K @ 20 ° C – 300℃

curamik® Power Plus

• HPS substrates provide enhanced robustness through Zr doped Al₂영형₃ ceramics
• Used in medium power output applications
• 열전도율을 제공합니다 26 W/M K @ 20 ° C
• 많은 두께 조합으로 제공됩니다
• CTE의 7.1 PPM/K @ 20 ° C – 300℃

curamik® Thermal

• Based on AlN ceramics and combines excellent thermal conductivity with good mechanical stability
• Used in very high operational voltage and power density applications
• 열전도율을 제공합니다 170 W/M K @ 20 ° C
• 많은 두께 조합으로 제공됩니다
• CTE의 4.7 PPM/K @ 20 ° C – 300℃

질문이 있으시면, 저희에게 연락 주시기 바랍니다info@alcantapcb.com , 기꺼이 도와드리겠습니다.