Ceramic PCB Fabrication

ceramic-pcb-fabrication

Ceramic PCB 제작. Addressing the unique challenges of satellite power supply design, curamik® ceramic substrates excel in demanding applications that require a long lifetime, high reliability and robustness. Si3N4 ceramic substrates, 예를 들어, carry higher currents and provide higher voltage isolation. They operate over a wide temperature range. 게다가, the different metal layers are combined hermetically using the curamik bonding process. We are the Ceramic PCB manufacturer in China.

In space, malfunction or failure as that may jeopardize an entire mission as power electronics cannot be repaired or replaced. Radiation and the absence of atmosphere and gravity make it necessary to use radiation-hardened components that dissipate heat by conduction and radiation only. Special provisions are required to prevent damage and provide reliable, long-term, unattended operation when it comes to designing how satellites are powered.

The high heat conductivity, along with the high heat capacity and thermal spreading of the thick copper cladding, makes curamik substrates indispensable to power electronics, particularly for mission-critical applications like satellite power management.

curamik® Performance

• Based on Si₃N₄ ceramics and produced in Active Metal Brazed (AMB) process
• Used in applications where long lifetime, high power density and robustness are required
• Offers thermal conductivity of 90 W/m K @ 20°C
• Available in 6 thickness combinations
• CTE of 2.5 ppm/K @ 20°C – 300℃

curamik® Power

• Al₂O₃ provides best price-performance ratio
• Offers sufficient thermal and mechanical properties for the most common applications
• Offers thermal conductivity of 24 W/m K @ 20°C
• Available in many thickness combinations
• CTE of 6.8 ppm/K @ 20°C – 300℃

curamik® Power Plus

• HPS substrates provide enhanced robustness through Zr doped Al₂O₃ ceramics
• Used in medium power output applications
• Offers thermal conductivity of 26 W/m K @ 20°C
• Available in many thickness combinations
• CTE of 7.1 ppm/K @ 20°C – 300℃

curamik® Thermal

• Based on AlN ceramics and combines excellent thermal conductivity with good mechanical stability
• Used in very high operational voltage and power density applications
• Offers thermal conductivity of 170 W/m K @ 20°C
• Available in many thickness combinations
• CTE of 4.7 ppm/K @ 20°C – 300℃

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