We are Ceramic Substrates PCB manufacturer. Rogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. Our curamik® substrates consist of pure copper bonded or brazed to a ceramic substrate and are designed to carry higher currents, provide higher voltage isolation and operate over a wide temperature range.
Our curamik Ceramic substrates offer high heat conductivity, high heat capacity and thermal spreading of the substrates’ thick copper cladding, making our substrates indispensable to power electronics. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on metal or plastic.
We have bought these types materials from an agent at Rogers Materials company and then process and produce blank circuit boards.
Benefits
- Great heat conductivity and temperature resistance
- High insulation voltage
- High heat spreading
- Low coefficient of thermal expansion outperforms metal or plastic substrates
- Adjusted expansion coefficient enables chip on board
- Efficient processing of master cards and single pieces
- Range of formulations optimized for various power applications
Curamik® Endurance
- Available in multiple ceramic types, including Al2O3 , HPS (ZTA), AlN
- Enhanced reliability performance compared to material combinations of the same dimensions
Our curamik Endurance substrates provide enhanced reliability performance compared to material combinations of the same dimensions. This reliability improvement makes the new substrates well suited for high power applications, such as in EV/HEV, vehicle electrification, general industrial, renewable energy and mass transit. curamik Endurance extends the field of applications for DBC.
Curamik® Metallized Ceramic Substrates
특징
- Available copper thickness of 0.3 mm
- Ceramic Types available include Al2O3 , HPS (ZTA), AlN
- Thermal conductivities of 24, 26 그리고 170 W/mK
- Ceramic available in multiple thicknesses according to standard Rogers DBC design rules
Benefits
- Enhanced reliability performance compared to material combinations of the same dimensions
- Suitable for high power applications
- Extraordinary increased lifetime
- Known material and combinations allow for easy implementation
The three curamik Endurance Substrates available include:
Curamik Endurance (Al2O3)
- Offers thermal conductivity of 24 W/mK @ 20°C
- CTE of 6.8 ppm/K @ 20°C – 300℃
- Available in many thickness combinations
Curamik Endurance Plus (HPS)
- Alumina (9% ZrO2 doped)
- Offers thermal conductivity of 26 W/mK @ 20°C
- CTE of 7.1 ppm/K @ 20°C – 300℃
- Available in many thickness combinations
Curamik Endurance Thermal (AlN)
- Based on Aluminum Nitride ceramics
- Offers thermal conductivity of 170 W/mK @ 20°C
- CTE of 4.7 ppm/K @ 20°C – 300℃
- Available in many thickness combinations
Curamik® Performance
- Based on Si3N4 ceramics and produced in Active Metal Brazed (AMB) process
- Used in applications where long lifetime, high power density and robustness are required
- Offers thermal conductivity of 90 W/m K @ 20°C
- Available in 6 thickness combinations
- CTE of 2.5 ppm/K @ 20°C – 300℃
Our curamik Performance substrates are based on Si3N4 ceramics joined with copper by active metal brazing (AMB). These substrates are ideal for applications that demand a long lifetime, high power density and robustness. Rogers curamik Performance is great for use in automotive power electronics, high reliability power modules, renewable energy and traction.
특징
- Thermal conductivity of 90 W/mK @ 20°C
- Available in 6 thickness combinations
- CTE of 2.5 ppm/K @ 20°C – 300℃
Benefits
- Superior performance in high demand, high power applications
- Enables higher power density
- Great balance of cost and performance
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