rt-duroid-6035-pcb
RT-듀로이드 6035 PCB, RT 6035 PCB 제작, RT/duroid 6035HTC laminates are an exceptional choice for high power applications. 라미네이트의 열전도율은 거의 2.4 표준 RT/duroid의 배 6000 제품, 그리고 동박 (ED 및 역치료) 우수한 장기 열 안정성. 추가적으로, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.
특징
Dielectric constant of 3.50 +/- .05
소산 계수 .0013 10GHz에서
열전도율 1.44 W/m/K at 80°C
Thermally stable low profile and reverse treat copper foil
이익
높은 열전도율
Improved dielectric heat dissipation, enabling lower operating temperatures for high power applications
우수한 고주파 성능
Lower insertion loss and excellent thermal stability of traces
RT/duroid® 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 표준 RT/duroid의 배 6000 제품, 그리고
구리박 (electrodeposited and reverse treat) 우수한 장기 열 안정성, RT/ duroid 6035HTC laminates are an exceptional choice for high power applications. Rogers advanced filler system enables excellent drill ability, reducing drilling costs as compared to standard high thermally conductive laminates which use alumina fillers.
At increasing power levels, Rogers measured the heat rise of a resistor placed on a microstrip circuit attached to a controlled heat sink. Thermal imaging was used to generate temperature rise data. The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit materials for each application.
디자인 질문에 대해서는. or RT-Duroid 6035 PCB 재료 질문. 질문이 있으시면, 저희에게 연락 주시기 바랍니다 info@alcantapcb.com , 우리는 당신을 도와 드리겠습니다.