Archives d'information de l'entreprise - Page 30 de 86 - TECHNOLOGIE ALCANTA(SHENZHEN)CO., LTD - Page 30

Fabricant de PCB micro-ondes/microtraces. PCB HDI, and BGA packages substrates supplier, the HDI Boards and Package Substrate will be made with High speed and High-frequency materials.or other types base materials.

Fabricant de substrats pour microtraces. Fournisseur de PCB Microgap DHI et de substrats Microtrace BGA, To use the High speed and high frequency materials, Nous proposons des substrats Microtrace BGA et des PCB HDI de 2 couche à 50 couches.

Fabricant de substrats militaires. High speed and High frequency material packaging substrate or HDI PCBs Manufacturer. Avancé, dedicated military circuit board production line, strict quality standards IPC Class 3.

RF Modules Substrate Manufacturer. High frequency and High speed material packaging substrate production. We offer advanced microtrace RF packaging substrate from 2 couche à 30 couches.

Metal Core PCB Manufacturer, Super-thick Copper PCBs, Heavy copper PCBs, and thicker Metal base PCBs manufacture, we offer Metal core PCB and Aluminium base from 1 couche à 30 couches.

Fabricant de substrats Microtrace BGA. Microtrace and Microgap HDI PCBs production, Nous utilisons la technologie avancée MSAP et SAP pour produire les substrats d'interconnexion multicouche élevés à partir de 2 à 30 couches.