Cavity substrate manufacturing
Cavity substrate manufacturing. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 レイヤーに 30 レイヤー.
Bt laminate substrate manufacturing
Bt laminate substrate manufacturing, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate.
Ultrathin BT PCB manufacturing
Ultrathin BT PCB manufacturing, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.
低 CET PCB 製造
Professional Low CET PCB manufacturing, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing PCB and package substrate.
極薄BT PCB製造
Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, 最も小さなトレースと間隔は9um/9umです.
リジッドフレックスパッケージ基板会社
Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.
電話番号: +86 (0)755-8524-1496
Eメール: info@alcantapcb.com