Chip-scale package Manufacturer
Chip-scale package and scale package substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging service vendor.
Embedded Cavity PCB Substrate Manufacturer
Embedded Cavity PCB Substrate Manufacturer. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.
FCCSP Flip Chip CSP package substrates Manufacturer
FCCSP Flip Chip CSP package substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.
Cavity PCB Substrate Manufacturer
Cavity PCB Substrate Manufacturer. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.
Flip Chip CSP (FCCSP) Firm
Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 couche à 20 couches. we also offer the Flip Chip CSP package service.
What is Ceramic package substrate?
Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 couche à 30 couches.
Tél: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com