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Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 couche à 20 couches. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 couche à 30 couches.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Substrat d'emballage avancé.

Semiconductor FC BGA substrate quote. Nous pouvons produire le meilleur pas de bosse le plus samlle avec 100um, La meilleure trace la plus petite est 9UM.

We are a professional Rigid-flex BGA substrate quote, Nous produisons principalement un substrat de pitch ultra-petit, ultra-small trace and PCBs.

We are a professional Rigid-flex packaging substrate quote supplier, Nous produisons principalement un substrat de pitch ultra-petit, ultra-small trace.