パナソニック メグトロンシリーズ基板
メグトロン7N,メグトロン7, メグトロン6, メグトロン4, メグトロン2素材,We offer Megtron series materials PCB from 2 レイヤーに 40 レイヤー. 超低伝送損失 高耐熱 多層構造. ラミネート R-5775(N) プリプレグ R-5670(N), ラミネート R-5775 プリプレグ R-5670, Laminate R-5785 Prepreg R-5680,Properties · Transmission loss performance Ranking in MEGTRON series. パナソニック メグトロンシリーズ 基板メーカー.Minimum Thickness PCB
Minimum Thickness PCB(0.05mm to 0.1mm), Final thin PCB. the Thinnest PCB.Lowest Spacing PCB Manufacture((1.5mil to 2.5mil).We offer high quality PCB from 2 レイヤーに 30 レイヤー. Fast lead time. and More cheaper price.Minimum Spacing PCB
Minimum Spacing PCB Fabrication. Alcanta offer the Minimum spacing PCB boards. We have produced the smallest spacning pcb circuit board. the distance between the pads and the pads. we made them with 30um(1.2ミル), 40um(1.6ミル), 50um(2.0ミル). 60um, 70um. the gap tolerance are +/-10um.PTFEテフロンPCB
PTFEテフロンPCB, PTFE-Like PCB, 高品質 PTFE テフロン素材の回路基板. and Ptfe-like base materials PC boards. we have made the PCB with Advanced Technologies. PTFE (ポリテトラフルオロエチレン) 非常によく知られた製品の学名です, エンジニアリングコミュニティの外でも; DuPont's trademarked Teflon has applications extending far beyond…BGAパッケージ
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom…