Blind Vias&Buried Vias PCB manufacturing
Blind Vias&Buried Vias PCB manufacturing. Super small spacing, super small via holes HDI PCBs. we offer high quality Blind Vias&Buried Vias from 4 camada para 50 camadas. fast shipping time. and high quality.
Fabricação de substratos cerâmicos para PCB
Fabricação de substratos cerâmicos para PCB. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 para 18 camadas,
Cross blind/enterrado via fabricação de PCB
Cross blind/enterrado via fabricação de PCB. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
3Fabricação de substrato de embalagens cerâmicas D
3Fabricação de substrato de embalagens cerâmicas D, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.
Mixed dielectric PCB manufacturing
Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Microvia Substrates manufacturing
Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa Denko and Ajinomoto High speed materials. or other types core materials.
Telefone: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com