Substratos de múltiplas cavidades fabricação
Substratos de múltiplas cavidades fabricação. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types.
Microvias | Blind Vias PCB Manufacturing
Microvias | Blind Vias PCB Manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 para 18.
Fabricação de PCBs de slot incorporado
Fabricação de PCBs de slot incorporado. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest.
Fabricação de PCB múltiplas cavidades
Fabricação de PCB múltiplas cavidades. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap.
Micro via PCB manufacturing
Micro via PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 para 18 camadas,
Embedded Components PCB manufacturing
Embedded Components PCB manufacturing, PCB de cavidade incorporada, Embedded slot PCB manufacture. Open the cavity on the PCBs. we have made many this cavity PCBs with high quality.
Telefone: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com