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Micro cavity PCB manufacturing. High speed and high frequency material cavity PCB/packaging substrate manufacturing. Advanced cavity packaging substrate.

BT Manufatura de PCBs de resina epóxi, Mini LED BT PCBs and BGA substrates supplier. Produzimos principalmente substrato de pitch bump ultra-pequeno, Substrato de embalagem de traço e espaçamento ultra-pequeno.

Micro cavity substrates manufacturing. Open a micro Cavity on the PCBs or BGA package substrates. we have made many cavity PCBs from 4 camada para 30 camadas. high quality and fast lead times.

Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.

Fabricação de substrato de cavidade. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 camada para 30 camadas.

Bt laminate substrate manufacturing, Produzimos principalmente substrato de pitch bump ultra-pequeno, Substrato de embalagem de traço e espaçamento ultra-pequeno.