Bt laminate substrate manufacturing
Bt laminate substrate manufacturing, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing packaging substrate.Ultrathin BT PCB manufacturing
Ultrathin BT PCB manufacturing, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.低 CET PCB 製造
Professional Low CET PCB manufacturing, 極小バンプピッチ基板を主に生産しております, ultra-small trace and spacing PCB and package substrate.極薄BT PCB製造
Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, the best smallest trace and spacing are 9um/9um.リジッドフレックスパッケージ基板会社
Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.半導体FC-BGA基板メーカー
半導体FC-BGA基板メーカー. We use advanced Msap and Sap technology, High multilayer interconnection.