Multi cavity substrates manufacturing
Multi cavity substrates manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types.マイクロビア | Blind Vias PCB manufacturing
マイクロビア | Blind Vias PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 に 18.Embedded Slot PCB Manufacturing
Embedded slot PCB manufacturing. 100umで最高のSamllestバンプピッチを作成できます, 最も小さなトレースは9umです. and the smallest.マルチキャビティ PCB の製造
マルチキャビティ PCB の製造. 100umで最高のSamllestバンプピッチを作成できます, 最も小さなトレースは9umです. and the smallest gap.Micro via PCB manufacturing
Micro via PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 に 18 レイヤー,Embedded Components PCB manufacturing
Embedded Components PCB manufacturing, 埋め込みキャビティ PCB, Embedded slot PCB manufacture. Open the cavity on the PCBs. we have made many this cavity PCBs with high quality.