Organic Packaging Chip Substrates Manufacturer
Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 レイヤーに 20 レイヤー.
世界的なパッケージ基板メーカー
世界的なパッケージ基板メーカー. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
トップ 10 package Substrate Manufacturer
トップ 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 レイヤーに 20 レイヤー.
Global Semiconductor packaging Manufacturer
Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
Global package Substrate Manufacturer
Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.
Module Substrates Manufacturer
Module Substrates Manufacturer, 極小バンプピッチ基板を主に生産しております, ultra-small trace and PCBs from 4 レイヤーに 20 レイヤー.
電話番号: +86 (0)755-8524-1496
Eメール: info@alcantapcb.com