News Archives - Ukurasa 44 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 44

Multi cavity substrates manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types.

Microvias | Blind Vias PCB manufacturing. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18.

Embedded slot PCB manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest.

Multi Cavity PCB Viwanda. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap.

Micro via PCB manufacturing. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka,

Embedded Components PCB manufacturing, Iliyopachikwa Cavity PCB, Embedded slot PCB manufacture. Open the cavity on the PCBs. we have made many this cavity PCBs with high quality.