News Archives - Page 45 of 96 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD

Organic Packaging Chip Substrates Manufacturer
March 4, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 layer to 20 layers.
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Global Packaging Substrate Manufacturer
March 1, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Global Packaging Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
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Top 10 package Substrate Manufacturer
February 29, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 layer to 20 layers.
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Global Semiconductor packaging Manufacturer
February 28, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
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Global package Substrate Manufacturer
February 27, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.
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Module Substrates Manufacturer
February 26, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Module Substrates Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs from 4 layer to 20 layers.
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