Jalada la habari - Ukurasa 47 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 47

Ultrathin BT PCB manufacturing, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.

Professional Low CET PCB manufacturing, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing PCB and package substrate.

Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, the best smallest trace and spacing are 9um/9um.

Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.

Semiconductor FC-BGA Substrate Mtengenezaji. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Muunganisho wa juu wa tabaka nyingi.

Semiconductor BGA substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate