Jalada la habari - Ukurasa 48 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 48

Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Ceramic package substrate Manufacturer. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Mtengenezaji wa ufungaji wa substrate. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka,

Juu 10 Ufungaji wa mtengenezaji wa substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 Tabaka kwa 20 tabaka.