Jalada la habari - Ukurasa 46 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 46

Viwanda vya Micro Cavity PCB. Kasi ya juu na utengenezaji wa nyenzo za masafa ya juu PCB/utengenezaji wa substrate ya ufungaji. Sehemu ya juu ya ufungaji wa cavity.

utengenezaji wa BT Epoxy Resin PCB, Mini LED BT PCBs na BGA substrates wasambazaji. sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, sehemu ndogo ya upakiaji ya kufuatilia na kuweka nafasi.

Utengenezaji wa substrates za cavity ndogo. Open a micro Cavity on the PCBs or BGA package substrates. we have made many cavity PCBs from 4 Tabaka kwa 30 tabaka. high quality and fast lead times.

Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.

Utengenezaji wa substrate ya cavity. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(yanayopangwa) production technique. we make the cavity PCBs from 4 Tabaka kwa 30 tabaka.

Utengenezaji wa substrate ya Bt laminate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, sehemu ndogo ya upakiaji ya kufuatilia na kuweka nafasi.