Global Packaging Substrate Manufacturer
Global Packaging Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
맨 위 10 package Substrate Manufacturer
맨 위 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 레이어 20 레이어.
Global Semiconductor packaging Manufacturer
Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
Global package Substrate Manufacturer
Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.
Module Substrates Manufacturer
Module Substrates Manufacturer, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and PCBs from 4 레이어 20 레이어.
Global Semiconductor Substrate Manufacturer
Global Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.
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