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CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 に 18 レイヤー.

FC-CSP基板メーカー. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.

High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.

SHDBU 基板メーカー. 当社は高度なMsapおよびSapテクノロジーを使用して、高多層相互接続パッケージ基板を製造します。 4 に 20 レイヤー.

高精度実装基板メーカー. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other high quality base package substrate or PCB boards materials.

High Frequency package Substrate Manufacturer. the Package Substrate will be made with Rogers materials(High Frequency base). or Showa Denko, Ajinomoto High speed materials.