CPCORE Structure Manufacturer
CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 para 18 camadas.
FC-CSP Substrates Manufacturer
FC-CSP Substrates Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.
High Speed package Substrate Manufacturer
High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.
SHDBU Substrates Manufacturer
SHDBU Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 para 20 camadas.
Fabricante de substrato de embalagem de alta precisão
Fabricante de substrato de embalagem de alta precisão. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other high quality base package substrate or PCB boards materials.
High Frequency package Substrate Manufacturer
High Frequency package Substrate Manufacturer. the Package Substrate will be made with Rogers materials(High Frequency base). or Showa Denko, Ajinomoto High speed materials.
Telefone: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com