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Fabricant de substrat du package BT FCCSP. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.

CSP package substrate Manufacturer. Fabrication de substrat d'emballage à grande vitesse et à haute fréquence. Advanced packaging substrate firm.

Flip Chip CSP Package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.

Professional Wire Bond Substrate Manufacturer, Nous produisons principalement un substrat de pitch ultra-petit, ultra-small trace and led PCBs from 2 couche à 20 couches.

Cavity Substrate PCB Manufacturer. High speed and high frequency material cavity packaging substrate and Cavity PCB boards manufacturing. Advanced production technology.

Chip-scale package and scale package substrates Manufacturer. Fabrication de substrat d'emballage à grande vitesse et à haute fréquence. Advanced packaging service vendor.