FCCSPフリップチップCSPパッケージ基板メーカー
FCCSPフリップチップCSPパッケージ基板メーカー. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.
Cavity PCB Substrate Manufacturer
Cavity PCB Substrate Manufacturer. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.
フリップチップCSP (fccsp) 固い
フリップチップCSP (fccsp) 固い. We produce the High speed and high frequency material packaging substrate from 2 レイヤーに 20 レイヤー. we also offer the Flip Chip CSP package service.
What is Ceramic package substrate?
Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 レイヤーに 30 レイヤー.
半導体BGA基質とは何ですか?
Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
What is a semiconductor FC BGA substrate?
Semiconductor FC BGA substrate quote. 100umで最高のSamllestバンプピッチを作成できます, 最も小さなトレースは9umです.
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