Arquivos de notícias - Página 53 de 101 - TECNOLOGIA ALCANTA(SHENZHEN)CO., LTD - Página 53

Embedded Cavity PCB Substrate Manufacturer. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.

FCCSP FLIP CHIP CSP Substratos de pacote fabricante. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.

Fabricante de substrato PCB de cavidade. PCB profissional de cavidade e substratos de componentes incorporados fábrica. Usamos processos de produção incorporados avançados.

FLIP CHIP CSP (FCCSP) Empresa. We produce the High speed and high frequency material packaging substrate from 2 camada para 20 camadas. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 camada para 30 camadas.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.