What is Rigid-Flex Packaging Substrate?
Rigid-Flex Packaging Substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
What is a semiconductor substrate?
We are a professional Semiconductor substrate, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.
What exactly is Ceramic Packaging Substrate?
Ceramic Packaging Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.high frequency materials.
What is IC Substrate?
We are a professional IC Substrate, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.
What is ABF Substrate?
We are a professional ABF Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.
What is FCBGA substrate?
FCBGA substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.
Telefone: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com