Rogers Cavity PCB manufacturing
Rogers Cavity PCB manufacturing. Open cavity Rogers PCBs. or buried cavity in the PCBs. Professional CAVITY PCB supplier. we offer the cavity PCB or buried cavity cavity PCB from 4 слой в 30 слои.
Слепые переходы&Buried Vias PCB manufacturing
Blind Vias&Buried Vias PCB manufacturing. Super small spacing, super small via holes HDI PCBs. we offer high quality Blind Vias&Buried Vias from 4 слой в 50 слои. fast shipping time. and high quality.
Ceramic PCB Substrates manufacturing
Ceramic PCB Substrates manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 к 18 слои,
Cross blind/buried via PCB manufacturing
Cross blind/buried via PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.
3D Ceramic Packages Substrate manufacturing
3D Ceramic Packages Substrate manufacturing, Advanced production technology. we offer 2D Ceramic Substrate, 2.5D Ceramic Substrate.
Mixed dielectric PCB manufacturing
Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Тел.: +86 (0)755-8524-1496
Электронная почта: info@alcantapcb.com