Как пользовательские субстраты BGA/IC повышают целостность сигнала
Custom BGA/IC Substrates play a crucial role in modern semiconductor packaging, serving as the bridge between the silicon chip and the printed circuit board (печатная плата). IC substrates provide electrical connections, механическая поддержка, and thermal dissipation pathways, ensuring the functionality and reliability of advanced electronic devices. Among various packaging technologies, Ball…
Пользовательский пакет класса стеклянного класса в 2,5D и 3D -упаковке
The rapid evolution of semiconductor technology has driven the need for more advanced packaging solutions to meet the increasing demands of high-performance computing, ИИ, and data-intensive applications. Traditional organic and silicon-based substrates are facing limitations in electrical performance, управление температурным режимом, and miniaturization. As a result, Custom Glass Class Package Substrate…
Процесс производства пользовательской рамки QFN/QFP
A Custom QFN/QFP Lead Frame is a specialized metal framework designed to provide electrical connections, механическая поддержка, and thermal dissipation for semiconductor devices using QFN (Quad Flat без свинца) or QFP (Quad Flat Package) packaging. These lead frames are tailored to meet specific design and performance requirements, ensuring optimal functionality in…
Ключевые преимущества пользовательской службы подложки пакета FCBGA в HPC
Custom FCBGA Package Substrate Service plays a pivotal role in advancing modern semiconductor packaging solutions. As a tailored service, it focuses on designing and manufacturing specialized substrates for FCBGA (Сетка из шариков с перевернутым чипом) packaging, a technology widely recognized for its high-performance and miniaturization capabilities. FCBGA packaging relies on flip-chip technology…
Многочисленная свинцовая рамка в полупроводниковой упаковке объяснена
Semiconductor packaging plays a crucial role in modern electronics, serving as the bridge between integrated circuits (ИС) and external components. It not only protects delicate semiconductor chips but also ensures efficient electrical connections and thermal management. As electronic devices become more compact and powerful, advanced packaging solutions are essential to…
Что такое малая интегральная схема (SEC)
The Small Outline Integrated Circuit (SEC) is a compact, surface-mount technology (SMT) package widely used in the electronics industry. Known for its small size and ease of assembly, SOIC is ideal for space-constrained applications like consumer electronics, automotive systems, and communication devices. It offers a balance between functionality and cost-effectiveness,…
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