Комплексное руководство по применению выводных рамок TSOP/LOC
The TSOP/LOC Lead Frame is a crucial component in modern electronic packaging, enabling efficient and compact integration of semiconductor devices. TSOP, or Thin Small Outline Package, is designed for high-density applications, while LOC, or Lead-on-Chip, enhances electrical performance by minimizing wire bonding lengths. Together, the TSOP/LOC Lead Frame offers a…
Структура пластикового носителя для чипов с выводами (ПЛКК) Ведущая рама
PLCC is a type of integrated circuit (IC) package that features leads extending from the sides of the chip carrier. The lead frame within the PLCC serves as the structural and electrical backbone, connecting the IC to the external circuitry. PLCC lead frames are widely used in applications like microprocessors,…
Полное руководство по выводной рамке плоского корпуса Thin Quad
Semiconductor packaging plays a crucial role in modern electronics, serving as the protective enclosure for integrated circuits while facilitating their connection to external systems. As devices continue to shrink and demand for higher performance grows, packaging solutions must evolve to meet these challenges. Among various packaging technologies, the Thin Quad…
Структура пластикового двойного линейного корпуса (ПДИП) Ведущая рама
The Plastic Dual In-line Package (ПДИП) Lead Frame is a critical component in the world of electronics, forming the backbone of one of the most widely used integrated circuit packaging formats. A Plastic Dual In-line Package (ПДИП) is a type of chip packaging characterized by two parallel rows of pins,…
Как правильно выбрать размер рамы Quad Flat без свинца
The Quad Flat Non-Lead Frame (QFN) is a compact and efficient surface-mount packaging technology widely used in modern electronic devices. Characterized by its leadless design, the Quad Flat Non-Lead Frame enables direct connection of the package to the printed circuit board (печатная плата) through exposed pads, improving electrical and thermal performance.…
Материалы и конструкция бессвинцовой упаковки (QFN) Свинцовая рама
In the fast-paced world of modern electronics, compact, эффективный, and reliable packaging solutions are essential to meet the demands of high-performance devices. Quad Flat No-Lead (QFN) packaging has emerged as a game-changer, offering a leadless design that ensures improved thermal performance, excellent electrical characteristics, and space-saving advantages. Its popularity spans…
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