Flip Chip CSP Package Substrate Manufacturer
Flip Chip CSP Package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.
Wire Bond Substrate Manufacturer
Professional Wire Bond Substrate Manufacturer, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and led PCBs from 2 레이어 20 레이어.
Cavity Substrate PCB Manufacturer
Cavity Substrate PCB Manufacturer. High speed and high frequency material cavity packaging substrate and Cavity PCB boards manufacturing. Advanced production technology.
Chip-scale package Manufacturer
Chip-scale package and scale package substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging service vendor.
Embedded Cavity PCB Substrate Manufacturer
Embedded Cavity PCB Substrate Manufacturer. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.
FCCSP Flip Chip CSP package substrates Manufacturer
FCCSP Flip Chip CSP package substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.
전화: +86 (0)755-8524-1496
이메일: info@alcantapcb.com